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High Precision Turnkey Pcb Assembly , Industrial Hdi Circuit Boards With OSP

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Shenzhen Lefang Electronics Co., Ltd

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High Precision Turnkey Pcb Assembly , Industrial Hdi Circuit Boards With OSP

Name: High Precision Turnkey Pcb Assembly Industrial Hdi Circuit Boards With OSP
Brand: LEFANG
Price: 1 USD

Best High Precision Turnkey Pcb Assembly , Industrial Hdi Circuit Boards With OSP wholesale

Brand Name : LEFANG

Model Number : RM0004L136

Certification : ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000

Place of Origin : Shenzhen,China

MOQ : 1 Piece

Price : Negotiable

Payment Terms : T/T, Western Union, Paypal, MoneyGram

Supply Ability : 290, 000 sqm Per Month

Packaging Details : Inner: Vacuum Packing; Dry Packing out Packing

Delivery Time : 2-10 work days

Raw material : Fr - 4

Layer count : 4 Layer

Board thickness : 1.6 mm

Copper thickness : 1 Oz / 35 µm

Surface treatment : OSP

Solder mask : Green

Board size2104 * 105 mm4.56 * 58.83 mm : 130 * 86 mm

Min. Aperture : 0.3 mm

Line Width/Space : 0.18 / 0.18 mm

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Turnkey Multilayer High Quality HDI Industrial PCB Circuit Board with OSP

HDI department in our company offer you turnkey multilayer pcb design and mass produce. The min. line Width/Space is 0.18 / 0.18 mm. And the PCB board size is 130 * 86 mm. Min. aperture of this pcb is 0.3mm, good for radiating.

High Precision Turnkey Pcb Assembly , Industrial Hdi Circuit Boards With OSP

Why choose LEFANG?

-- Lefang provides One-Stop solution to save your cost and time.

Quick Quotation - Competitive factory price is always offered

Free Sample - Sample for free before mass production

Quality Control - Sales Team monitors the production quality and lead time

On Time Delivery - Customize the logistics plan according to customer’s requirement

After-sale Service - Reply to the claim within 24 hours to make sure our customer’s manufacturing

How to get quick quotation?

Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc

Step 2 Also please provide us the below details for quick quotation:

Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others

Material brand: SY / KB / Rogers (optional)

Material Specification:High Tg / copper based / aluminum based or others (optional)

Board thickness: 0.1 - 6.0 mm

Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um )

Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin

Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc

Board size and quantity

If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone.

SAMPLE:

Board Basic Info - SAMPLE
Board material	Fr - 4
Material brand	KB
Material Specification	Tg 170
Board thickness	1.6 mm
Copper thickness	1 Oz
Surface Treatment	ENIG
Solder mask / sSilk print	Green / White
Board size	100 mm * 100 mm
Quantity	10k

Lead Time

Layer count	Sample lead time/workday	Batch lead time/workday
1-2L	2	6
4L	5	8
6L	5	9
8L	6	10
10L	8	10
12L	8	12
14L	10	15
16L	10	18
18-40L (Up to difficulty)	at least 18	at least 24
P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays

How many advanced automated equipments do we have?

-- We have spent massively on purchasing below advanced automated production equipments.

Equipment Name	Plant in Shenzhen	Plant in Dongguan
CCD exposure machine	8	12
AOI test machine	6	8
Mechanical drilling rig	26	53
Automatic edge finishing machine	2	2
Pressing machine	2	2
VCP	0	2
Electroplating line	1	2
CNC routing machine	12	12
Automatic tester	10	16

Now send us your inquiry, and you will be replied within 8 hours!

Little knowledge - Multilayer PCB Board

Multilayer printed circuit boards (Multilayer PCBs) represented the next major evolution in fabrication technology.

A very sophisticated and complex methodology came from the base platform of double sided plated.

This methodology would again allow circuit board designers a dynamic range of interconnects and applications.

Multilayer PCB board were essential in the advancement of modern computing, and their basic construction and fabrication are similar to micro chip fabrication on a micro size.

The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills, and it can be built on ceramic, copper, and aluminum. Also, blind and buried vias are commonly produced in multilayer pcb manufacturing, along with pad on via technology.

Product Tags:

industrial circuit board

hdi circuit boards

High Precision Turnkey Pcb Assembly , Industrial Hdi Circuit Boards With OSP Images

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